Heating Cure / Self- Levelling Epoxy Electronic Potting System

Heating Cure / Self- Levelling Epoxy Electronic Potting System

  • Heating Cure / Self- Levelling Epoxy Electronic Potting System
Packaging: 10,20kg barrel

Product Description

Heating Cure / Self- Levelling Epoxy Electronic Potting System Good Flexibility CW-200

Light coating, self- Levelling, Bubble Free, High Adhesion, Good Flexibility.

Easy to operate, Faster curing, Curing on normal temperature or Heating cure

 

 

Description:

 

CW-200 is used for electrically potting insulating parts for application in indoor equipment such as post-type insulators, supports, switchgear, bushing, current and voltage transformers

 

Major Character:

1. Appearance: Light coating, self- Levelling, Bubble Free, High Adhesion, Good Flexibility.

2. Processing Property: Easy to operate, Faster curing, Curing on normal temperature or Heating cure

3. Physical Property: Can endure transformer running for long time, steady performance, Can protect transformer core.

  

 Applications:

 

 

 

 

 

 

Specifications:

 

Item

Unit

Test values

Organ chlorine

eq/100g<

0.02

Inorganic Chlorine

eq/100g<

0.001

Fugitive Constituent

%

0.5

Epoxy Value

eq/100g

0.24-0.28

Co lour

<

3

Softening Point

°C

45-50

Ash

%

0.009

Density(25°C)

g/cm3

1.10-1.20

Acid Value

mgKOH/100g

0

Viscosity(25°C)

mPa.s

300-500

Viscosity Increment

(120°C×24h)

%

4

Gelatinizing Time(120°C)

min

102

Using Techniques:

1. Formula A: CW200 Epoxy Resin: Silica Filler: Mixed Anhydride Hardener

= 100:200:30

2. Formula B: CW200 Epoxy Resin: Alumina Filler: Methyl Tetrahydr Opthalic Anhydride = 100:350:36

3. Operate Techniques: Put the epoxy resins in vacuum reactor system first, heat to 130°C and melt it, put the pre-heated filler, vacuum degassing 5 mmHg for twenty minutes than release the vacuum, put the hardener than pouring-in the moulds, after that put in the heater on 130°C to cure.

4. Curing Condition: 130°C curing for 24 Hours to de-mould.

The Properties of cured:

Formula A (Silica Formula) the curing technics with the mechanical and electrical properties of cured.

 

Item

Unit

Test values

Operating Time(140°C)

min

112

Bending Strength

MPa

143

Impacting Strength

kJ/m2

13.5

Heat Distortion Temperature

°C

104

Arc Resistance

s

182

Comparative Tracking Index Mark

V

600

Electric Strength

MV/m

38

Linear Expansion Coefficient

×10-6/K

27.6

Volume Resistivity

RT

Ω-cm

1.1×1014

100°C

Ω-cm

1.3×1013

Dielectric loss

Factor

RT

-

1.6×10-2

100°C

-

2.3×10-2

Formula B (Alumina Formula) the curing techniques with mechanical and electrical properties (Test Value)

 

Item

Unit

Test values

Initial Viscosity (130°C)

mPa.s

2200

Operating Time(130°C)

min

61

Bending Strength

MPa

134

Impacting Strength

kJ/m2

13.0

Heat Distortion Temperature

°C

107

Arc Resistance

s

189

Comparative Tracking Index Mark

V

600

Electric Strength

MV/m

30.3

Linear Expansion Coefficient

×10-6/K

34.5

Volume Resistivity

RT

Ω-cm

1.7×1014

100°C

Ω-cm

3.4×1013

Dielectric Loss

Factor

RT

-

4.8×10-2

100°C

-

9.6×10-2

 

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