Thermal - Conductive Fast Curing One Part Epoxy Resin Dust - Proof With Low Viscosity

Thermal - Conductive Fast Curing One Part Epoxy Resin Dust - Proof With Low Viscosity

  • Thermal - Conductive Fast Curing One Part Epoxy Resin Dust - Proof With Low Viscosity
Packaging: 10,20kg barrel

Product Description

 

Thermal - Conductive Fast Curing Dust - Proof One Part Epoxy Resin With Low Viscosity

 

1. Low Viscosity, Smooth Casting

2. Faster curing, filling port surface bright and clean.

3. Flammability Property and Electric Property are good

 

Description:

WEXP-86 is a single component curable thermal-conductive & flame-retardant Epoxy Encapsulating, with low adhesive and excellent flow and it can penetrate into the gap of products; it can be solidified through normal temperature or heating with suitable speed of solidification; there is no bubble with plain and glazing surface and high hardness; the solidified materials have an excellent performance of anti-alkaline, waterproof, oil- proof and dust-proof, which is humid and thermal resistant and air aging; it owns excellent electric and physical features of insulation, anti-pressing and high degree of adhesive.

Main Features:

1. Low Viscosity, Smooth Casting

2. Faster curing, filling port surface bright and clean.

3. Flammability Property and Electric Property are good

 

Applications:

WEXP-86 is used for gel in the short time.

 

Specifications:

Product Technical Specification: 

Appearance

-

Clear amber liquid

Viscosity(25°C)

mPa.s

650-800

Density(25°C)

g/cm3

1.14

              Gel time

m

<15

 

 

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